DocumentCode :
2782472
Title :
New Understanding on the Breakdown of High-K Dielectric Stacks using Multi-Vibrational Hydrogen Release Model
Author :
Rafik, M. ; Ribes, G. ; Roy, D. ; Ghibaudo, G.
Author_Institution :
STMicroelectronics, Crolles
fYear :
2007
fDate :
15-19 April 2007
Firstpage :
44
Lastpage :
48
Abstract :
The breakdown of HfO2, HfZrO2 and HfSiON gate stacks with TiN metal gate under substrate injection regime is investigated and confronted with the multivibrational hydrogen release model. It turns out that for HfO2 and HfZrO2 because no Si-H bonds are present at the TiN interface, MVHR from Si-H bonds can not take place. Moreover, even adapting the model by supposing hydrogen release from another type of bond, or considering other conventional models, breakdown mechanism remains undefined. Nevertheless, for HfSiON for which Si-H bonds are present, modeling based on MVHR becomes consistent with experimental values.
Keywords :
dielectric materials; electric breakdown; hafnium compounds; oxygen compounds; silicon compounds; titanium compounds; zirconium compounds; HfO2; HfSiON; HfZrO2; TiN; high-K dielectric stacks breakdown; multivibrational hydrogen release model; substrate injection; Breakdown voltage; Design for quality; Dielectric breakdown; Electric breakdown; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; Hydrogen; Stress; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location :
Phoenix, AZ
Print_ISBN :
1-4244-0919-5
Electronic_ISBN :
1-4244-0919-5
Type :
conf
DOI :
10.1109/RELPHY.2007.369866
Filename :
4227607
Link To Document :
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