DocumentCode :
2782487
Title :
Progressive Breakdown Characteristics of High-K/Metal Gate Stacks
Author :
Bersuker, G. ; Chowdhury, N. ; Young, C. ; Heh, D. ; Misra, D. ; Choi, R.
Author_Institution :
SEMATECH, Austin, TX
fYear :
2007
fDate :
15-19 April 2007
Firstpage :
49
Lastpage :
54
Abstract :
Breakdown characteristics of Hf-based high-k dielectrics in a wide thickness range were investigated to identify the "weak link" in the gate stack and its leading breakdown mechanisms under inversion stress. A strong correlation among the growth rates of the stress leakage current, SILC, and interface trap density suggests that breakdown is triggered by trap generation in the interfacial SiO2 layer. Stress-time evolution of the differential resistance and its slope obtained from SILC data allows progressive breakdown in high-k/metal gate stacks to be identified
Keywords :
dielectric materials; electric breakdown; hafnium; interface states; leakage currents; silicon compounds; Hf; SILC; differential resistance; high-k dielectrics; interface trap density; interfacial layer; inversion stress; metal gate stacks; progressive breakdown; stress leakage current; stress-time evolution; trap generation; Breakdown voltage; Dielectric breakdown; Electric breakdown; Electrodes; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; Leakage current; Stress; Tin; breakdown; high-k; trap generation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location :
Phoenix, AZ
Print_ISBN :
1-4244-0919-5
Electronic_ISBN :
1-4244-0919-5
Type :
conf
DOI :
10.1109/RELPHY.2007.369867
Filename :
4227608
Link To Document :
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