DocumentCode :
2782760
Title :
Outer Lead Bonding Process Conditions For TFT-LCD Module
Author :
Hu, Dyi Chung ; Ho, Shyuan Jeng ; Tang, Bao Yun
Author_Institution :
Electronic Research and Service Organization, ITRI, Hsinchu, Taiwan.
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
277
Lastpage :
282
Keywords :
Anisotropic conductive films; Bonding; Contact resistance; Glass; Lead; Liquid crystal displays; Polyimides; Polymer films; Temperature; Thin film transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639904
Filename :
639904
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2782760
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