• DocumentCode
    2782768
  • Title

    SiGe BiCMOS Technology: An IC Design Platform for Extreme Environment Electronics Applications

  • Author

    Cressler, John D.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
  • fYear
    2007
  • fDate
    15-19 April 2007
  • Firstpage
    141
  • Lastpage
    149
  • Abstract
    The drivers in the extreme environment electronics community are beginning to perk up their ears to the possibilities of using SiGe technology, especially for space electronics applications. The present NASA-funded project, "SiGe integrated electronics for extreme environments," which is aimed at enabling more effective lunar exploration, represents a \´first\´ of sorts - a chance to develop the requisite SiGe infrastructure; from technology, to characterization tools, to modeling, to circuit design, to packaging, to reliability, to functional sub-systems, needed to support the development and eventual insertion of SiGe into emerging extreme environment venues. The authors are excited about our progress, and firmly believe that the greater electronics community can and should leverage this effort for a wide variety of their applications. Ensuring adequate reliability for SiGe technologies in these new application venues will require more effort from the reliability community. Initial results look very promising indeed.
  • Keywords
    BiCMOS integrated circuits; Ge-Si alloys; integrated circuit design; packaging; reliability; BiCMOS technology; NASA-funded project; SiGe; extreme environment electronics applications; integrated circuit design; lunar exploration; packaging; reliability; space electronics applications; Application specific integrated circuits; BiCMOS integrated circuits; Circuit synthesis; Driver circuits; Ear; Germanium silicon alloys; Integrated circuit technology; Moon; Silicon germanium; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    1-4244-0919-5
  • Electronic_ISBN
    1-4244-0919-5
  • Type

    conf

  • DOI
    10.1109/RELPHY.2007.369883
  • Filename
    4227624