DocumentCode
2782768
Title
SiGe BiCMOS Technology: An IC Design Platform for Extreme Environment Electronics Applications
Author
Cressler, John D.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
fYear
2007
fDate
15-19 April 2007
Firstpage
141
Lastpage
149
Abstract
The drivers in the extreme environment electronics community are beginning to perk up their ears to the possibilities of using SiGe technology, especially for space electronics applications. The present NASA-funded project, "SiGe integrated electronics for extreme environments," which is aimed at enabling more effective lunar exploration, represents a \´first\´ of sorts - a chance to develop the requisite SiGe infrastructure; from technology, to characterization tools, to modeling, to circuit design, to packaging, to reliability, to functional sub-systems, needed to support the development and eventual insertion of SiGe into emerging extreme environment venues. The authors are excited about our progress, and firmly believe that the greater electronics community can and should leverage this effort for a wide variety of their applications. Ensuring adequate reliability for SiGe technologies in these new application venues will require more effort from the reliability community. Initial results look very promising indeed.
Keywords
BiCMOS integrated circuits; Ge-Si alloys; integrated circuit design; packaging; reliability; BiCMOS technology; NASA-funded project; SiGe; extreme environment electronics applications; integrated circuit design; lunar exploration; packaging; reliability; space electronics applications; Application specific integrated circuits; BiCMOS integrated circuits; Circuit synthesis; Driver circuits; Ear; Germanium silicon alloys; Integrated circuit technology; Moon; Silicon germanium; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location
Phoenix, AZ
Print_ISBN
1-4244-0919-5
Electronic_ISBN
1-4244-0919-5
Type
conf
DOI
10.1109/RELPHY.2007.369883
Filename
4227624
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