DocumentCode :
2782935
Title :
Development Of An Alternative Wire Bond Test Technique
Author :
Lall, Pradeep ; Barker, Donald ; Pecht, Michael
Author_Institution :
University of Maryland
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
283
Lastpage :
287
Keywords :
Bonding forces; Educational institutions; Electronic equipment testing; Electronics packaging; Geometry; Inspection; Process control; Quality assurance; Ultra large scale integration; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639905
Filename :
639905
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2782935
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