DocumentCode :
2783064
Title :
Wire-bonding machine optimization using Taguchi method
Author :
Saint-Martin, X. ; Yuan Chollet
Author_Institution :
BULL S.A.
fYear :
1992
fDate :
1992
Firstpage :
74
Lastpage :
83
Keywords :
Bonding forces; Ceramics; Costs; Magnetic heads; Optimization methods; Packaging machines; Reproducibility of results; Very large scale integration; Wafer bonding; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN :
0-7803-0629-5
Type :
conf
DOI :
10.1109/IEMT.1992.763397
Filename :
763397
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2783064
بازگشت