DocumentCode :
2783127
Title :
Evolution of molding material of biased plastic package components aged by hygrothermic cycling
Author :
Rousseau, C. ; Lombaërt-Valot, I. ; Chopin, J.M. ; Nakache, E. ; Jasse, B.
Author_Institution :
Aerospatiale
fYear :
1992
fDate :
1992
Firstpage :
100
Lastpage :
107
Keywords :
Absorption; Aging; Circuit testing; Degradation; Electronic components; Electronics packaging; Materials testing; Performance evaluation; Plastic packaging; Silicon compounds;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN :
0-7803-0629-5
Type :
conf
DOI :
10.1109/IEMT.1992.763400
Filename :
763400
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2783127
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