• DocumentCode
    2783129
  • Title

    Mechanism and Modeling of PMOS NBTI Degradation with Drain Bias

  • Author

    Luo, Yuhao ; Orona, Joel ; Nayak, Deepak ; Gitlin, Daniel

  • Author_Institution
    Technol. Dev. Group, Xilinx Inc., San Jose, CA
  • fYear
    2007
  • fDate
    15-19 April 2007
  • Firstpage
    264
  • Lastpage
    267
  • Abstract
    A new mechanism for PMOS NBTI (negative biased temperature instability) with drain bias is presented. The turnaround behavior of device degradation is explained. While drain bias reduces gate oxide voltage and causes less NBTI, the channel-hot-hole enhances the NBTI degradation. For the first time, a semi-empirical model is proposed that fits well with the experimental data, including various parameters, such as temperature, voltage, channel length, and drive current.
  • Keywords
    MOSFET; semiconductor device models; semiconductor device reliability; NBTI; PMOS transistors; channel-hot-hole; device degradation; negative biased temperature instability; CMOS technology; Circuit testing; Current measurement; Degradation; Hot carriers; Niobium compounds; Stress; Temperature dependence; Titanium compounds; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    1-4244-0919-5
  • Electronic_ISBN
    1-4244-0919-5
  • Type

    conf

  • DOI
    10.1109/RELPHY.2007.369903
  • Filename
    4227644