Title :
Mechanical properties of soft solder materials for electronic applications
Author :
Beuers, J. ; Pteschek, G. ; Schlamp, G.
Author_Institution :
Demetron GmbH
Keywords :
Electronic components; Heat sinks; Intermetallic; Lead; Materials reliability; Mechanical factors; Metallization; Soldering; Stability; Testing;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN :
0-7803-0629-5
DOI :
10.1109/IEMT.1992.763402
