DocumentCode

2783180

Title

A Fine Pitch And High Aspect Ratio Bump Array For Flip-chip Interconnection

Author

Yamada, Hiroshi ; Konooh, Y. ; Saito, Masayuki

Author_Institution

Toshiba Corporation

fYear

1992

fDate

28-30 Sep 1992

Firstpage

288

Lastpage

292

Keywords

Aluminum; Capacitive sensors; Copper; Fabrication; Integrated circuit interconnections; Large scale integration; Polyimides; Resists; Substrates; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International

Print_ISBN

0-7803-0755-0

Type

conf

DOI

10.1109/IEMT.1992.639906

Filename

639906