DocumentCode :
2783196
Title :
Automatic gang bonding, the alternative process
Author :
Schiebel, Gunter
Author_Institution :
Siemens AG
fYear :
1992
fDate :
1992
Firstpage :
146
Lastpage :
155
Keywords :
Bonding; Inspection; Laser beams; Lead; Position measurement; Printers; Quality assurance; Semiconductor device measurement; Signal resolution; Vacuum systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN :
0-7803-0629-5
Type :
conf
DOI :
10.1109/IEMT.1992.763405
Filename :
763405
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2783196
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