DocumentCode
2783196
Title
Automatic gang bonding, the alternative process
Author
Schiebel, Gunter
Author_Institution
Siemens AG
fYear
1992
fDate
1992
Firstpage
146
Lastpage
155
Keywords
Bonding; Inspection; Laser beams; Lead; Position measurement; Printers; Quality assurance; Semiconductor device measurement; Signal resolution; Vacuum systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN
0-7803-0629-5
Type
conf
DOI
10.1109/IEMT.1992.763405
Filename
763405
Link To Document