DocumentCode :
2783212
Title :
Manufacturing requirements for fine-pitch interconnection technology
Author :
Modi, Anuj ; Hermann, F.
Author_Institution :
NCR GmbH
fYear :
1992
fDate :
1992
Firstpage :
169
Lastpage :
176
Keywords :
Bonding; Components, packaging, and manufacturing technology; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Lead; Manufacturing processes; Production; Soldering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN :
0-7803-0629-5
Type :
conf
DOI :
10.1109/IEMT.1992.763407
Filename :
763407
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2783212
