DocumentCode

2783272

Title

COB: manufacturing of cost effective - high reliability miniature modules

Author

Fieseler, M.

Author_Institution

Philips GmbH

fYear

1992

fDate

1992

Firstpage

192

Lastpage

196

Keywords

Bonding; Conductive adhesives; Costs; Flip chip; Gold; Manufacturing; Packaging; Silicon; Soldering; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International

Print_ISBN

0-7803-0629-5

Type

conf

DOI

10.1109/IEMT.1992.763410

Filename

763410