مرکز منطقه ای اطلاع رساني علوم و فناوري - Equipment selecmon for tape automated bonding (TAB)

DocumentCode :

2783300

Title :

Equipment selecmon for tape automated bonding (TAB)

Author :

Miller, Michael C.

Author_Institution :

Hewlett Packard

fYear :

1992

fDate :

1992

Firstpage :

205

Lastpage :

212

Keywords :

Bonding processes; Conductive adhesives; Feeds; Gravity; Manufacturing; Packaging; Plastics; Protection; Prototypes; Virtual reality;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International

Print_ISBN :

0-7803-0629-5

Type :

conf

DOI :

10.1109/IEMT.1992.763412

Filename :

763412

Link To Document :