Title :
Ceramic reinforced materials: A new tool for electronic designers to meet the improved thermal and mechanical properties required in high performance electronic systems
Author :
Silzars, By ; Keck, S. ; Aghajanian, K. ; Gramegna, E.
Author_Institution :
Lamxide Electronic Components
Keywords :
Aluminum; Ceramics; Composite materials; Conducting materials; Costs; Electronic components; Electronic packaging thermal management; Heat sinks; Silicon carbide; Thermal conductivity;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN :
0-7803-0629-5
DOI :
10.1109/IEMT.1992.763414
