DocumentCode
2783336
Title
Ceramic reinforced materials: A new tool for electronic designers to meet the improved thermal and mechanical properties required in high performance electronic systems
Author
Silzars, By ; Keck, S. ; Aghajanian, K. ; Gramegna, E.
Author_Institution
Lamxide Electronic Components
fYear
1992
fDate
1992
Firstpage
221
Lastpage
228
Keywords
Aluminum; Ceramics; Composite materials; Conducting materials; Costs; Electronic components; Electronic packaging thermal management; Heat sinks; Silicon carbide; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN
0-7803-0629-5
Type
conf
DOI
10.1109/IEMT.1992.763414
Filename
763414
Link To Document