DocumentCode :
2783353
Title :
Hardness reduction of Au bumps for tab interconnections
Author :
Baggerman, A.F.J. ; Kessels, F.J.H.
Author_Institution :
Philips Centre For Manufacturing Technology
fYear :
1992
fDate :
1992
Firstpage :
229
Lastpage :
236
Keywords :
Annealing; Artificial intelligence; Bonding forces; Gold; Integrated circuit interconnections; Manufacturing automation; Metallization; Resists; Temperature; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN :
0-7803-0629-5
Type :
conf
DOI :
10.1109/IEMT.1992.763415
Filename :
763415
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2783353
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