DocumentCode :
2783374
Title :
Thermomechanical Characterization Of Flip Chip Solder Bumps For Multichip Module Applications
Author :
Lau, John H.
Author_Institution :
Hewlett-Packard Company
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
293
Lastpage :
299
Keywords :
Capacitive sensors; Fatigue; Flip chip; Joining materials; Multichip modules; Soldering; Thermal expansion; Thermal factors; Thermal stresses; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639907
Filename :
639907
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2783374
