Title :
Contactless testing of printed wiring boards
Author_Institution :
Rensselaer Polytechnic Institute
Keywords :
Contacts; Electronics packaging; Manufacturing; Plasma applications; Plasma measurements; Probes; System testing; Test equipment; Velocity measurement; Wiring;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN :
0-7803-0629-5
DOI :
10.1109/IEMT.1992.763421