Title :
Process and technology choices for manufacturing high density interconnections on silicon surstrates for multichip modules
Author :
Davies, M.J. ; Logan, E.A. ; Munns, A.G. ; Pedder, L. D J
Author_Institution :
GEC-Marconi Materials Technology Ltd
Keywords :
Assembly; Dielectric substrates; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Manufacturing processes; Metal-insulator structures; Silicon; Surface-mount technology; Thermal conductivity;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1992. IEMT 1992. 12th International
Print_ISBN :
0-7803-0629-5
DOI :
10.1109/IEMT.1992.763422
