DocumentCode :
2783513
Title :
Effect of Scratch Stress on the Surface Hardness and Inner Structures of a Capacitive Fingerprint Sensor LSI
Author :
Shimoyama, N. ; Shigematsu, S. ; Morimura, H. ; Shimamura, T. ; Kumazaki, T. ; Nakanishi, M. ; Ishii, H. ; Machida, K.
Author_Institution :
NTT Microsystem Integration Labs., NTT Corp., Kanagawa
fYear :
2007
fDate :
15-19 April 2007
Firstpage :
412
Lastpage :
416
Abstract :
The authors performed a scratch test in which a weighted needle applies scratch stress to the surface of a capacitive fingerprint sensor large scale integration (LSI), which has a grounded wall (GND wall) structure where each sensor plate is surrounded by a lattice-like wall. The scratch stress degrades not only the sensor´s surface but also the metal interlayer. Increasing the thickness of the surface passivation film and that of the interlayer reduce the degradation of the surface and inner structures. To confirm the influence of thick passivation film on the electrostatic discharge (ESD) hardness and the intensity of sensing of the fingerprint sensor LSI, the authors performed an air discharge test and fingerprint identification. The tests show that a thick passivation film and a thick interlayer are effective in preventing scratch stress with ESD hardness and the intensity of sensing of the fingerprint sensor LSI.
Keywords :
capacitive sensors; electronic equipment testing; electrostatic discharge; fingerprint identification; large scale integration; stress effects; thick film sensors; air discharge test; capacitive fingerprint sensor LSI; electrostatic discharge; fingerprint identification; metal interlayer; scratch stress; scratch test; surface hardness; surface passivation film; thick passivation film; Capacitive sensors; Degradation; Electrostatic discharge; Fingerprint recognition; Large scale integration; Passivation; Performance evaluation; Stress; Surface discharges; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location :
Phoenix, AZ
Print_ISBN :
1-4244-0919-5
Electronic_ISBN :
1-4244-0919-5
Type :
conf
DOI :
10.1109/RELPHY.2007.369925
Filename :
4227666
Link To Document :
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