DocumentCode :
2783567
Title :
Pb-free Soldering Alternatives For Fine Pitched Electronics Packaging
Author :
Felton, L.E. ; Raeder, C.H. ; Havasy, C.K. ; Knorr, D.B.
Author_Institution :
Rensselaer Polytechnic Institute
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
300
Lastpage :
304
Keywords :
Capacitive sensors; Electronics industry; Electronics packaging; Fatigue; Manufacturing; Powders; Productivity; Soldering; Surface emitting lasers; Technology transfer;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639908
Filename :
639908
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2783567
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