DocumentCode
2783747
Title
Reliability of High-Power IGBT Modules for Traction Applications
Author
Ciappa, Mauro ; Castellazzi, Alberto
Author_Institution
Integrated Syst. Lab., Swiss Fed. Inst. of Technol., Zurich
fYear
2007
fDate
15-19 April 2007
Firstpage
480
Lastpage
485
Abstract
The enhancement of the system efficiency in conjunction with a reduction of weight and volume in transportation applications requires high temperature power devices with reduced losses and with an optimized thermal management. This paper addresses the main technology issues and some recently-developed design tools to be considered in order to reach the imposed reliability level.
Keywords
insulated gate bipolar transistors; reliability; thermal management (packaging); traction; transportation; high temperature power devices; high-power IGBT modules; optimized thermal management; power device reliability; traction applications; transportation applications; Automotive engineering; Circuits; Cooling; Energy management; Insulated gate bipolar transistors; Power system reliability; Rail transportation; Technology management; Temperature; Thermal management; IGBT; Power device reliability; electromagnetic simulation; simulation; thermal management; traction;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location
Phoenix, AZ
Print_ISBN
1-4244-0919-5
Electronic_ISBN
1-4244-0919-5
Type
conf
DOI
10.1109/RELPHY.2007.369938
Filename
4227679
Link To Document