Title :
Reliability of High-Power IGBT Modules for Traction Applications
Author :
Ciappa, Mauro ; Castellazzi, Alberto
Author_Institution :
Integrated Syst. Lab., Swiss Fed. Inst. of Technol., Zurich
Abstract :
The enhancement of the system efficiency in conjunction with a reduction of weight and volume in transportation applications requires high temperature power devices with reduced losses and with an optimized thermal management. This paper addresses the main technology issues and some recently-developed design tools to be considered in order to reach the imposed reliability level.
Keywords :
insulated gate bipolar transistors; reliability; thermal management (packaging); traction; transportation; high temperature power devices; high-power IGBT modules; optimized thermal management; power device reliability; traction applications; transportation applications; Automotive engineering; Circuits; Cooling; Energy management; Insulated gate bipolar transistors; Power system reliability; Rail transportation; Technology management; Temperature; Thermal management; IGBT; Power device reliability; electromagnetic simulation; simulation; thermal management; traction;
Conference_Titel :
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location :
Phoenix, AZ
Print_ISBN :
1-4244-0919-5
Electronic_ISBN :
1-4244-0919-5
DOI :
10.1109/RELPHY.2007.369938
