DocumentCode
2783763
Title
No-clean And Water-clean Mass Reflow Processes Of 0.4 mm Pitch, 256-Pin Fine Pitch Quad Flat Packs (QFP)
Author
Lau, John ; Govila, Ratan ; Larner, Chuck ; Pao, Yi-Hsin ; Erasmus, Steve ; Dolot, Stan ; Solberg, Vern
Author_Institution
Hewlett-Packard Company
fYear
1992
fDate
28-30 Sep 1992
Firstpage
305
Lastpage
315
Keywords
Components, packaging, and manufacturing technology; Copper; Electronic packaging thermal management; Electronics packaging; Lead; Plastics; Scanning electron microscopy; Soldering; Solvents; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN
0-7803-0755-0
Type
conf
DOI
10.1109/IEMT.1992.639909
Filename
639909
Link To Document