DocumentCode :
2783763
Title :
No-clean And Water-clean Mass Reflow Processes Of 0.4 mm Pitch, 256-Pin Fine Pitch Quad Flat Packs (QFP)
Author :
Lau, John ; Govila, Ratan ; Larner, Chuck ; Pao, Yi-Hsin ; Erasmus, Steve ; Dolot, Stan ; Solberg, Vern
Author_Institution :
Hewlett-Packard Company
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
305
Lastpage :
315
Keywords :
Components, packaging, and manufacturing technology; Copper; Electronic packaging thermal management; Electronics packaging; Lead; Plastics; Scanning electron microscopy; Soldering; Solvents; Space technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639909
Filename :
639909
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2783763
بازگشت