Title :
Knowledge Based Decision Support For Surface Mount Infrared Reflow Soldering
Author :
Wu, Chien-Hsing ; Srihari, K. ; McLenaghan, A.J.
Author_Institution :
T.J. Watson School Of Engineering And Applied Science
Keywords :
Artificial intelligence; Assembly systems; Electronics packaging; Expert systems; Heating; Ovens; Printed circuits; Reflow soldering; Surface-mount technology; Temperature;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
DOI :
10.1109/IEMT.1992.639910