DocumentCode
2784022
Title
An Efficient Certification Approach for New SN-AG-CU Solder Alloy
Author
Masicat, Josephine ; Kumar, Chetan ; Nuda, Mitzi
Author_Institution
Intel Technol. Philippines Inc.
fYear
2007
fDate
15-19 April 2007
Firstpage
564
Lastpage
565
Abstract
This poster presentation showcase the certification methodologies employed for Intel´s cellular handheld products in qualifying the Sn-Ag-Cu solder alloy, SAC105, on wire bonded packages. SAC 105 which contains 98.5% tin, 1.0% silver and 0.5% copper was identified as another viable solution to enhance package solder joint reliability performance.
Keywords
certification; copper alloys; lead bonding; silver alloys; solders; tin alloys; Sn-Ag-Cu; Sn-Ag-Cu solder alloy; cellular handheld products; certification approach; solder joint reliability; wire bonded packages; Certification; Copper; Electric shock; Environmentally friendly manufacturing techniques; Packaging; Silver; Soldering; Temperature; Testing; Tin; SAC; solder alloy; solder joint reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location
Phoenix, AZ
Print_ISBN
1-4244-0919-5
Electronic_ISBN
1-4244-0919-5
Type
conf
DOI
10.1109/RELPHY.2007.369952
Filename
4227693
Link To Document