Title :
Themixed-Mode Damage Spectrum of Sige HBTs
Author :
Cheng, Peng ; Zhu, Chendong ; Cressler, John D. ; Joseph, Alvin
Author_Institution :
Sch. of Electr. & Comput. Eng., Atlanta, GA
Abstract :
We present a new mixed-mode stress technique for assessing the complete mixed-mode damage spectrum of SiGe HBTs, and apply it to three SiGe technology generations. We are able to distinguish four distinct regions of cross-generational SiGe HBT stress-response, identify a new low-current density damage mechanism in 3rd generation devices, and observe for the first time a novel stress-induced annealing phenomenon. The implications of these observations are addressed.
Keywords :
Ge-Si alloys; annealing; current density; heterojunction bipolar transistors; SiGe; SiGe HBT; SiGe technology; low-current density damage mechanism; mixed-mode damage spectrum; mixed-mode stress technique; stress-induced annealing phenomenon; third generation devices; Annealing; Current density; Germanium silicon alloys; Heterojunction bipolar transistors; Hot carriers; Impact ionization; Silicon germanium; Temperature; Thermal conductivity; Thermal stresses;
Conference_Titel :
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location :
Phoenix, AZ
Print_ISBN :
1-4244-0919-5
Electronic_ISBN :
1-4244-0919-5
DOI :
10.1109/RELPHY.2007.369953