DocumentCode
2784068
Title
The Role of Power Dissipation on the Progressive Breakdown Dynamics of Ultra-Thin Gate Oxides
Author
Miranda, E.
Author_Institution
Departament d´´Enginyeria Electronica, Univ. Autonoma de Barcelona, Bellaterra
fYear
2007
fDate
15-19 April 2007
Firstpage
572
Lastpage
573
Abstract
The connection between the leakage current increase in ultra-thin gate oxides associated with the progressive dielectric breakdown and the power dissipation dynamics at the breakdown spot is investigated. Using a simple equivalent circuit model and the transmission properties of mesoscopic conducting systems, it is shown that the current stabilization during a constant voltage stress is linked to the gradual transfer of dissipated power from the bottleneck of the breakdown path to the semiconductor electrodes.
Keywords
dielectric materials; electric breakdown; equivalent circuits; leakage currents; mesoscopic systems; dielectric breakdown dynamics; equivalent circuit model; leakage current; mesoscopic conducting systems; power dissipation dynamics; semiconductor electrodes; transmission properties; ultra-thin gate oxides; voltage stress; Breakdown voltage; Dielectric breakdown; Electric breakdown; Electrodes; Equivalent circuits; Leakage current; Power dissipation; Power system modeling; Semiconductor device breakdown; Stress; MOS; breakdown; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location
Phoenix, AZ
Print_ISBN
1-4244-0919-5
Electronic_ISBN
1-4244-0919-5
Type
conf
DOI
10.1109/RELPHY.2007.369956
Filename
4227697
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