• DocumentCode
    2784068
  • Title

    The Role of Power Dissipation on the Progressive Breakdown Dynamics of Ultra-Thin Gate Oxides

  • Author

    Miranda, E.

  • Author_Institution
    Departament d´´Enginyeria Electronica, Univ. Autonoma de Barcelona, Bellaterra
  • fYear
    2007
  • fDate
    15-19 April 2007
  • Firstpage
    572
  • Lastpage
    573
  • Abstract
    The connection between the leakage current increase in ultra-thin gate oxides associated with the progressive dielectric breakdown and the power dissipation dynamics at the breakdown spot is investigated. Using a simple equivalent circuit model and the transmission properties of mesoscopic conducting systems, it is shown that the current stabilization during a constant voltage stress is linked to the gradual transfer of dissipated power from the bottleneck of the breakdown path to the semiconductor electrodes.
  • Keywords
    dielectric materials; electric breakdown; equivalent circuits; leakage currents; mesoscopic systems; dielectric breakdown dynamics; equivalent circuit model; leakage current; mesoscopic conducting systems; power dissipation dynamics; semiconductor electrodes; transmission properties; ultra-thin gate oxides; voltage stress; Breakdown voltage; Dielectric breakdown; Electric breakdown; Electrodes; Equivalent circuits; Leakage current; Power dissipation; Power system modeling; Semiconductor device breakdown; Stress; MOS; breakdown; reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    1-4244-0919-5
  • Electronic_ISBN
    1-4244-0919-5
  • Type

    conf

  • DOI
    10.1109/RELPHY.2007.369956
  • Filename
    4227697