DocumentCode :
2784240
Title :
A hardware/software co-verification platform for ASIC design
Author :
Dai, Xue-Qiu ; Liu, Bu-Min ; Xie, Chun-Yi ; Wang, Wan-Cai
Author_Institution :
Dept. of Microelectron. & Solid-State Electron., Univ. of Electron. Sci. & Technol. of China (UESTC), Chengdu, China
fYear :
2009
fDate :
23-25 Oct. 2009
Firstpage :
416
Lastpage :
420
Abstract :
This paper presents a hardware/software co-verification platform for ASIC design, which is based on Windows-Linux operating systems. The platform is not only used for verifying the hardware/software compatibility of maintain-and-update development ASIC chips, but also used for achieving that the hardware and software develop synchronously when developing absolutely new ASIC chips. Adopting this platform, we can not only give full functional verifications to our hardware and software more efficiently, but can also shorten the entire developmental period of our productions. In this paper, the system scheme of this platform and its operating principles are introduced, and the arithmetic of the bus-functional-model interface is illustrated. The hardware/software compatibility of several maintain-and-update chips have been guaranteed by using this platform, and the final productions´ time-to-market decreased 3 months on average.
Keywords :
application specific integrated circuits; electronic engineering computing; formal verification; hardware-software codesign; ASIC design; bus-functional-model interface; hardware-software compatibility; hardware-software coverification platform; maintain-and-update chip; Application specific integrated circuits; Field programmable gate arrays; Hardware; Operating systems; Production; Programming; Software maintenance; Software quality; Software testing; System testing; ASIC; bus-functional-model interface; hardware/software co-verification; socket;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Apperceiving Computing and Intelligence Analysis, 2009. ICACIA 2009. International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-5204-0
Electronic_ISBN :
978-1-4244-5206-4
Type :
conf
DOI :
10.1109/ICACIA.2009.5361068
Filename :
5361068
Link To Document :
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