Title :
Failure Analysis and Optimization of Metal Fuses for Post Package Trimming
Author :
Cheng, Yu-Hsing ; Kendrick, Christian E.
Author_Institution :
Analog Technol. Dev., ON Semicond., East Greenwich, RI
Abstract :
Post package trimming is important in achieving precise control of circuit parameters that may shift due to package stresses. However, the size of on-chip driver circuitry must be minimized while still maintaining reliably trimmed fuses. This study presents a statistical analysis and physical characterization of trimmed fuses to optimize fuse geometry and trimming conditions.
Keywords :
failure analysis; integrated circuit packaging; statistical analysis; failure analysis; metal fuses; on-chip driver circuitry; post package trimming; statistical analysis; Aggregates; Circuit testing; Driver circuits; Electric resistance; Failure analysis; Fuses; Geometry; Pulse circuits; Semiconductor device packaging; Space vector pulse width modulation; Metal fuse; post package trimming;
Conference_Titel :
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location :
Phoenix, AZ
Print_ISBN :
1-4244-0919-5
Electronic_ISBN :
1-4244-0919-5
DOI :
10.1109/RELPHY.2007.369978
