Title :
On the Interaction Between Inter-Metal Dielectric Reliability and Electromigration Stress
Author :
Li, Yunlong ; Bruynseraede, Christophe ; Groeseneken, Guido ; Maex, Karen ; Tökei, Zsolt
Author_Institution :
IMEC, Leuven
Abstract :
The interaction between inter-metal dielectric reliability and electromigration stress is addressed. The basic finding is that the electromigration stress of the copper wire degrades the inter-metal dielectric reliability. The possible reason is the floating wire induced potential drop across the inter-metal dielectric.
Keywords :
copper; dielectric materials; dielectric measurement; electromigration; low-k dielectric thin films; reliability; wires (electric); Cu; copper electromigration; copper wire; electromigration stress; floating wire induced potential drop; intermetal dielectric reliability; low-k dielectric reliability; Copper; Dielectrics; Electromigration; Life testing; Stress measurement; Temperature distribution; Thermal degradation; Thermal stresses; Voltage; Wire; TDDB; copper electromigration; low-k dielectric reliability;
Conference_Titel :
Reliability physics symposium, 2007. proceedings. 45th annual. ieee international
Conference_Location :
Phoenix, AZ
Print_ISBN :
1-4244-0919-5
Electronic_ISBN :
1-4244-0919-5
DOI :
10.1109/RELPHY.2007.369991
