DocumentCode
2784786
Title
A micro-fabricated planar high-current IrOx stimulating microelectrode
Author
Ziaie, Babak ; Von Arx, Jeffrey A. ; Najafi, Khdil
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Volume
1
fYear
1996
fDate
31 Oct-3 Nov 1996
Firstpage
270
Abstract
Describes the development and presents test results of a thin-film, high-current density, iridium oxide (IrOx) microelectrode for neuromuscular stimulation. The electrode is made of a silicon substrate with polysilicon lines as the interconnect and IrOx as the electrode material. The polysilicon lines are protected from body fluids by silicon dioxide and silicon nitride. The electrode is capable of injecting large amounts of charge (~2 μC) through a small area (~0.3 mm2), and can withstand more than 2 billion 10 mA, 200 μsec, charge balanced current pulses in phosphate buffered saline (PBS) with minimal degradation in performance. IrOx is used as the electrode material because of its high charge injection capacity. These electrodes are fabricated using standard microelectronic fabrication technologies
Keywords
bioelectric phenomena; current density; iridium compounds; microelectrodes; muscle; neurophysiology; prosthetics; 10 mA; 200 mus; FES; Si; SiN; SiO2; body fluids protection; charge balanced current pulses; electrode material; functional electrical stimulation; interconnect; microfabricated planar high-current IrOx stimulating microelectrode; minimal performance degradation; neuromuscular stimulation electrode; phosphate buffered saline; polysilicon lines; silicon substrate; standard microelectronic fabrication technologies; thin-film high-current density microelectrode; Degradation; Electrodes; Microelectrodes; Microelectronics; Neuromuscular stimulation; Protection; Silicon compounds; Substrates; Testing; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1996. Bridging Disciplines for Biomedicine. Proceedings of the 18th Annual International Conference of the IEEE
Conference_Location
Amsterdam
Print_ISBN
0-7803-3811-1
Type
conf
DOI
10.1109/IEMBS.1996.656948
Filename
656948
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