DocumentCode
2784806
Title
In-situ measuring material parameters of a MEMS thin-film with a center-anchored circular plate by non-contact method
Author
Chen, Han ; Rong, Hua
Author_Institution
Dept. of Comput. Sci. ICA, PLA Univ. of Sci. & Technol., Nanjing, China
fYear
2011
fDate
7-10 Aug. 2011
Firstpage
2327
Lastpage
2332
Abstract
Research in mechanical characteristics and material parameters of MEMS thin-films is significant to the MEMS device. In-situ measuring these parameters such as Young´s modulus and stress gradient is essential to promote the performance of MEMS device. A center-anchored circular plate adopted as the test structure which is used to in-situ measure the material parameters of MEMS thin-films by a non-contact method has been present here. The advantages have been arranged. The influence to the resonance frequency with different dimensions of the anchor also has been studied.
Keywords
Young´s modulus; micromechanical devices; MEMS device; MEMS thin-film; Young modulus; center-anchored circular plate; in-situ measuring material parameters; noncontact method; stress gradient; Frequency measurement; Micromechanical devices; Resonant frequency; Stress; Stress measurement; Substrates; Centre-anchored circular plate; In-situ measuring; Stress gradient; Young´s modulus;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics and Automation (ICMA), 2011 International Conference on
Conference_Location
Beijing
ISSN
2152-7431
Print_ISBN
978-1-4244-8113-2
Type
conf
DOI
10.1109/ICMA.2011.5986349
Filename
5986349
Link To Document