Title :
In-situ measuring material parameters of a MEMS thin-film with a center-anchored circular plate by non-contact method
Author :
Chen, Han ; Rong, Hua
Author_Institution :
Dept. of Comput. Sci. ICA, PLA Univ. of Sci. & Technol., Nanjing, China
Abstract :
Research in mechanical characteristics and material parameters of MEMS thin-films is significant to the MEMS device. In-situ measuring these parameters such as Young´s modulus and stress gradient is essential to promote the performance of MEMS device. A center-anchored circular plate adopted as the test structure which is used to in-situ measure the material parameters of MEMS thin-films by a non-contact method has been present here. The advantages have been arranged. The influence to the resonance frequency with different dimensions of the anchor also has been studied.
Keywords :
Young´s modulus; micromechanical devices; MEMS device; MEMS thin-film; Young modulus; center-anchored circular plate; in-situ measuring material parameters; noncontact method; stress gradient; Frequency measurement; Micromechanical devices; Resonant frequency; Stress; Stress measurement; Substrates; Centre-anchored circular plate; In-situ measuring; Stress gradient; Young´s modulus;
Conference_Titel :
Mechatronics and Automation (ICMA), 2011 International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-8113-2
DOI :
10.1109/ICMA.2011.5986349
