DocumentCode
2785095
Title
Comparison of multichip module technologies for the electronic packaging-of high clock digital signal processors
Author
Gilbert, Barry K. ; Schwab, Daniel J. ; Randall, Barbara M. ; Thompson, Rick L. ; Hakes, Rick J. ; Mielke, Lloyd O. ; Schaefer, Timothy M. ; Zabinski, Patrick J. ; Walters, Wayne L.
Author_Institution
Mayo Foundation
fYear
1994
fDate
1994
Keywords
Circuit testing; Clocks; Electronic equipment testing; Electronics packaging; Fabrication; Gallium arsenide; Integrated circuit packaging; Multichip modules; Noise level; Semiconductor device packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
Type
conf
DOI
10.1109/WPTMT.1994.763516
Filename
763516
Link To Document