DocumentCode
2785178
Title
CIMID, a technology for high density integration of electronic systems
Author
Beyne, Eric ; Van Hoof, R. ; Roggen, J. ; Van Puymbroeck, Jan ; Heerman, M. ; Gouwy, G. ; Bulcke, F.
Author_Institution
IMEC
fYear
1994
fDate
1994
Keywords
Bonding; Connectors; Dielectric substrates; Dielectric thin films; Integrated circuit interconnections; Joining processes; Metallization; Polymer films; Thin film circuits; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
Type
conf
DOI
10.1109/WPTMT.1994.763520
Filename
763520
Link To Document