Title :
CIMID, a technology for high density integration of electronic systems
Author :
Beyne, Eric ; Van Hoof, R. ; Roggen, J. ; Van Puymbroeck, Jan ; Heerman, M. ; Gouwy, G. ; Bulcke, F.
Author_Institution :
IMEC
Keywords :
Bonding; Connectors; Dielectric substrates; Dielectric thin films; Integrated circuit interconnections; Joining processes; Metallization; Polymer films; Thin film circuits; Wire;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763520
