Title :
Design Tradeoffs When Using SMT, COB, And/or TAB packaging Technology
Keywords :
Assembly; Bonding; Consumer electronics; Costs; Electronics packaging; Microassembly; Product design; Silicon; Surface-mount technology; Wire;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
DOI :
10.1109/IEMT.1992.639917
