Design Tradeoffs When Using SMT, COB, And/or TAB packaging Technology

fYear

1992

fDate

28-30 Sep 1992

Firstpage

343

Lastpage

347

Keywords

Assembly; Bonding; Consumer electronics; Costs; Electronics packaging; Microassembly; Product design; Silicon; Surface-mount technology; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International

Print_ISBN

0-7803-0755-0

Type

conf

DOI

10.1109/IEMT.1992.639917

Filename

639917

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