Title :
High frequency properties of ceramic multilayer structures
Author :
Bihler, Eckardt ; Exner, Michael ; Thust, Klaus-Heiko ; Müller, Jens
Author_Institution :
IBM Deutschland
Keywords :
Analytical models; Ceramics; Circuit testing; Coupling circuits; Frequency; Integrated circuit interconnections; Microelectronics; Nonhomogeneous media; Semiconductor device packaging; System performance;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763524
