• DocumentCode
    2785278
  • Title

    An investigation into the technology of automatic probing of the international nodes of multichip modules

  • Author

    Posse, Ken ; Booth, George

  • Author_Institution
    Hewlett Packard Company
  • fYear
    1994
  • fDate
    1994
  • Keywords
    Circuit testing; Costs; Manufacturing; Multichip modules; Packaging; Printed circuits; Probes; Production; Springs;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
  • Type

    conf

  • DOI
    10.1109/WPTMT.1994.763526
  • Filename
    763526
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2785278