Title :
Cooling of multi chip module by the use of two-phase flow in liquid channels
Author :
Kristiansen, H. ; Gulliksen, M. ; Buran, T. ; Bjorneklett, A.
Author_Institution :
SINTEF SI
Keywords :
Cooling; Detectors; Diodes; Fluid flow; Heat transfer; Microstrip; Silicon; Surface treatment; Temperature; Testing;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763529
