DocumentCode :
2785370
Title :
Accurate prediction of PQFP warpage
Author :
Kelly, G. ; Lyden, C. ; Lawton, W. ; Barrett, J. ; Saboni, A. ; Exposito, J. ; Lamourelle, F.
Author_Institution :
University College
fYear :
1994
fDate :
1994
Keywords :
Adhesives; Chemicals; Conducting materials; Electronic packaging thermal management; Encapsulation; Mechanical factors; Plastic packaging; Power measurement; Stress; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
Type :
conf
DOI :
10.1109/WPTMT.1994.763530
Filename :
763530
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2785370
