DocumentCode

2785431

Title

cost effective ceramic surface maount packaging for high I/O applications

Author

Miks, Jeff

Author_Institution

Motorola, Inc.

fYear

1994

fDate

1994

Keywords

Ceramics; Costs; Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on

Type

conf

DOI

10.1109/WPTMT.1994.763534

Filename

763534