• DocumentCode
    2785453
  • Title

    A new breed of ball grid array package

  • Author

    Ahn, Seung-ho ; Kim, Gu-Sung

  • Author_Institution
    Samsung, Electronics Co., LTD.
  • fYear
    1994
  • fDate
    1994
  • Keywords
    Assembly; Ceramics; Conducting materials; Costs; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Semiconductor device packaging; Thermal conductivity; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
  • Type

    conf

  • DOI
    10.1109/WPTMT.1994.763535
  • Filename
    763535
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2785453