Title :
A new breed of ball grid array package
Author :
Ahn, Seung-ho ; Kim, Gu-Sung
Author_Institution :
Samsung, Electronics Co., LTD.
Keywords :
Assembly; Ceramics; Conducting materials; Costs; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Semiconductor device packaging; Thermal conductivity; Thermal management;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763535
