Tab with bumpless chips

Author

DEHAINE, Gérard ; COURANT, Patrick

Author_Institution

Bull S.A.

fYear

1994

fDate

1994

Keywords

Circuits; Coatings; Error correction; Gold; Manufacturing; Thickness control; Very large scale integration; Wafer bonding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on

Type

DOI

10.1109/WPTMT.1994.763537

Filename

763537

Link To Document