Alternative metallization by low cost electroless plating for MCM applications

Author

Ostmann, A. ; Aschenbrenner, R. ; Beutler, U. ; Reichl, H.

Author_Institution

Technical University of Berlin

fYear

1994

fDate

1994

Keywords

Adhesives; Aluminum; Bonding processes; Copper; Costs; Integrated circuit interconnections; Metallization; Nickel; Packaging; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on

Type

DOI

10.1109/WPTMT.1994.763538

Filename

763538

Link To Document