Flip chip attach of GaAs devices using ball bump technology

Author

Eldring, J. ; Zakel, E. ; Reichl, H.

Author_Institution

Technical University of Berlin

fYear

1994

fDate

1994

Keywords

Bonding forces; Costs; Flip chip; Frequency; Gallium arsenide; Gold; Integrated circuit interconnections; Lead; Wafer bonding; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on

Type

DOI

10.1109/WPTMT.1994.763539

Filename

763539

Link To Document