Title :
Flip chip attach of GaAs devices using ball bump technology
Author :
Eldring, J. ; Zakel, E. ; Reichl, H.
Author_Institution :
Technical University of Berlin
Keywords :
Bonding forces; Costs; Flip chip; Frequency; Gallium arsenide; Gold; Integrated circuit interconnections; Lead; Wafer bonding; Wire;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763539