Title :
Flip chip attack and RF-eviduation of GaAs-assemblies
Author :
Richter, H. ; Koelzer, P. ; Baumgartner, A.
Author_Institution :
Alcatel SEL AG
Keywords :
Assembly; Bonding; Flip chip; Gold; Protection; Semiconductor device measurement; Semiconductor devices; Substrates; Testing; Wire;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763540
