• DocumentCode
    2785550
  • Title

    Flip chip attack and RF-eviduation of GaAs-assemblies

  • Author

    Richter, H. ; Koelzer, P. ; Baumgartner, A.

  • Author_Institution
    Alcatel SEL AG
  • fYear
    1994
  • fDate
    1994
  • Keywords
    Assembly; Bonding; Flip chip; Gold; Protection; Semiconductor device measurement; Semiconductor devices; Substrates; Testing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
  • Type

    conf

  • DOI
    10.1109/WPTMT.1994.763540
  • Filename
    763540
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2785550