Title :
The mechanical stability of fline-pitch tab outer lead bonds in -dependence of the soldering process
Author :
Modl, A. ; Möller, W.
Author_Institution :
NCR GmbH
Keywords :
Bonding; Laser stability; Lead; Soldering; Substrates; Temperature; Testing; Thermal force; Thermal stability; Thermal stresses;
Conference_Titel :
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
DOI :
10.1109/WPTMT.1994.763541
