The mechanical stability of fline-pitch tab outer lead bonds in -dependence of the soldering process

Author

Modl, A. ; Möller, W.

Author_Institution

NCR GmbH

fYear

1994

fDate

1994

Keywords

Bonding; Laser stability; Lead; Soldering; Substrates; Temperature; Testing; Thermal force; Thermal stability; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on

Type

DOI

10.1109/WPTMT.1994.763541

Filename

763541

Link To Document