DocumentCode
2785590
Title
3D silicon multi-chip-modules
Author
Massit, Claude ; Nicolas, Gérard
Author_Institution
LETI
fYear
1994
fDate
1994
Keywords
Anisotropic magnetoresistance; Capacitors; Costs; Etching; Multiprocessor interconnection networks; Packaging; Random access memory; Read-write memory; Silicon; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on
Type
conf
DOI
10.1109/WPTMT.1994.763542
Filename
763542
Link To Document