2785590

3D silicon multi-chip-modules

Massit, Claude ; Nicolas, Gérard

LETI

1994

1994

Anisotropic magnetoresistance; Capacitors; Costs; Etching; Multiprocessor interconnection networks; Packaging; Random access memory; Read-write memory; Silicon; Wafer bonding;

English

ieee

MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on

conf

10.1109/WPTMT.1994.763542

763542