2785639

Characterisation and reliability evaluation of a verticle multichip module (NCM-TV) technique using test chips

Barrett, John ; Cahill, C. ; Compagno, T. ; Flaherty, Martin O. ; Hayes, T. ; Lawton, W. ; Donavan, J.O. ; McCarthy, G. ; Slattery, O. ; Waldron, F. ; Vera, A. Coella ; Masgrangeas, M. ; Val, C. ; Drouhin, I.

University College Cork

1994

1994

Corrosion; Microelectronics; Multichip modules; Plastics; Resistors; Semiconductor device measurement; Strain measurement; Testing; Thermal stresses; Thermomechanical processes;

English

ieee

MCM and VLSI Packaging Techniques and Manufacturing Technologies, 1994. Workshop on

conf

10.1109/WPTMT.1994.763544

763544