DocumentCode :
2785761
Title :
Excimer Vs ND:YAG Laser Creation Of Silicon Vias For 3D Interconnects
Author :
Lee, Rex A. ; Moreno, Wilfrido A. ; Gassman, Richard A. ; Miller, Doyle
Author_Institution :
University Of South Florida
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
358
Lastpage :
360
Keywords :
Drilling; Gas lasers; Laser beams; Microelectronics; Optical materials; Pulsed laser deposition; Silicon; Stacking; Surface emitting lasers; Surface morphology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639920
Filename :
639920
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2785761
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