DocumentCode
2785761
Title
Excimer Vs ND:YAG Laser Creation Of Silicon Vias For 3D Interconnects
Author
Lee, Rex A. ; Moreno, Wilfrido A. ; Gassman, Richard A. ; Miller, Doyle
Author_Institution
University Of South Florida
fYear
1992
fDate
28-30 Sep 1992
Firstpage
358
Lastpage
360
Keywords
Drilling; Gas lasers; Laser beams; Microelectronics; Optical materials; Pulsed laser deposition; Silicon; Stacking; Surface emitting lasers; Surface morphology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN
0-7803-0755-0
Type
conf
DOI
10.1109/IEMT.1992.639920
Filename
639920
Link To Document