Title :
Alignment Techniques For High Precision Pick And Place In Electronic Packaging
Author :
Sun, Sung Ping ; Wu, Fei-Jain
Author_Institution :
Micro Robotics Systems, Inc.
Keywords :
Calibration; Circuits; Electronics packaging; Glass; Lead; Machine components; Machine vision; Microscopy; Service robots; Sun;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
DOI :
10.1109/IEMT.1992.639921
