DocumentCode

2785936

Title

Alignment Techniques For High Precision Pick And Place In Electronic Packaging

Author

Sun, Sung Ping ; Wu, Fei-Jain

Author_Institution

Micro Robotics Systems, Inc.

fYear

1992

fDate

28-30 Sep 1992

Firstpage

361

Lastpage

365

Keywords

Calibration; Circuits; Electronics packaging; Glass; Lead; Machine components; Machine vision; Microscopy; Service robots; Sun;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International

Print_ISBN

0-7803-0755-0

Type

conf

DOI

10.1109/IEMT.1992.639921

Filename

639921